Syringe package Thermal Compound with a conductivity of 4.63 W / mK 1.5 grams equivalent to 0.75ml
Productnr. 101786
Thermigrease TG20088 Syring with 5 gr
Thermal grease from about 80% ultra-fine silver and a Boron nitride ceramic substrate. By default, electrically nonconductive, opt. Viscosity at 0 ° C to 150 ° C, heat transfer coefficient 9.0W/mK in syringe to 5 grams Made in Germany
Productnr. 101300
Thermigrease TG20088 Syring with 1 gr
Thermal grease from about 80% ultra-fine silver and a Boron nitride ceramic substrate. By default, electrically nonconductive, opt. Viscosity at 0 ° C to 150 ° C, heat transfer coefficient 9.0W/mK in syringe 1 gram Made in Germany
Productnr. 100989
Thermigrease TG20088 Syring with 30 gr
Thermal grease from about 80% ultra-fine silver and a Boron nitride ceramic substrate. By default, electrically nonconductive, opt. Viscosity at 0 ° C to 150 ° C, heat transfer coefficient 9.0W/mK In syringe to 35 grams Made in Germany
Productnr. 100716
Shin Etsu T11 Thermal Interface Pad
Shin Etsu T11 Thermal Interface Pad Size: 20x20x0,3 mm
Productnr. 100200
Honeywell PCM45 Thermal Interface Pad
High thermal conductivity (3 W / mK) and low thermal impedance (< 0.25°C/W) Phase Change Material (PCM) for high performance IC devices. Size: 20 x 20 mm (+/- 0,2mm) Thickness: 0.25 mm (+/- 0.065 mm) Phase change at 45°C 32 pcs per sheet Country of origin USA
Productnr. 100266
Chomerics T725 Thermal Interface Pad
Thermal Interface for AMD Socket 7 processors Dimension 25,4 x 25,4 mm with removal tab Thickness 0,13 mm (0,005") Thermal Impedance 0,03°C/W