Thermal grease from about 80% ultra-fine silver and a Boron nitride ceramic substrate. By default, electrically nonconductive, opt. Viscosity at 0 ° C to 150 ° C, heat transfer coefficient 9.0W/mK in syringe 1 gram Made in Germany
Productnr. 100989
Chomerics T725 Thermal Interface Pad
Thermal Interface for AMD Socket 7 processors Dimension 25,4 x 25,4 mm with removal tab Thickness 0,13 mm (0,005") Thermal Impedance 0,03°C/W