Cooling Solutions

 

1U passive BGA Heatsink E1NP-ASPBX-0000F

for BGA Chip Cooling, ChipSet Cooling

1U Aluminum extruded Chip Sink, surface finish black anodized
Dimensions: 65Lx58Wx11Hmm, Weight: 49g
Hole distance: 41x41mm
with Push Pin or Screw & Spring (with thermal grease)
RoHS & REACh compliant, Made in China

 
Productnr. 103362

1U passive BGA Chip Cooler E1NP-ASBI1-0000F

for BGA Chip Cooling, ChipSet Cooling
Socket uFCBGA479

1U Aluminum extruded heatsink
Dimensions: 49Lx50Wx36Hmm, Weight: 98g
Hole distance: 41x41mm
with thermal pad T725
RoHS & REACh compliant, Made in PRC

 
Productnr. 103278

1U passive CPU-Cooler/ CPU-Kühler E1SP-AWBX-0000D

for BGA Chip Cooling, ChipSet Cooling

1U Aluminum Chip Sink
Dimensions 30.5Lx30.5Wx12.3Hmm, Weight 8g
RoHS & REACh compliant, Made in Taiwan

 
Productnr. 100732