1U Aluminum Chip Sink
Dimensions: 37.5Lx37.4Wx6Hmm, Weight: 12g
Fastener: TIM
RoHS compliant, Made in Taiwan
Productnr. 100708
1U passive BGA Heatsink E1NP-ASPBX-0000F
for BGA Chip Cooling, ChipSet Cooling
1U Aluminum extruded Chip Sink, surface finish black anodized
Dimensions: 65Lx58Wx11Hmm, Weight: 49g
Hole distance: 41x41mm
with Push Pin or Screw & Spring (with thermal grease)
RoHS & REACh compliant, Made in China
Productnr. 103362
1U passive BGA Chip Cooler E1NP-AWPBX-0000F
for BGA Chip Cooling, ChipSet Cooling
1U Aluminum extruded Chip Sink
Dimensions: 39.95Lx39.95Wx22Hmm, Weight: 16g
Hole distance diagonal: 46.6mm
with Push Pin & thermal pad Honeywell PTM3180
RoHS & REACh compliant, Made in PRC
Productnr. 103470
1U passive BGA Heatsink T1SP-CWXX-0000D
for BGA Chip Cooling, ChipSet Cooling
1U Aluminum skived fins with copper base
Dimensions: 92.35Lx68Wx19.5Hmm / copper base: 30Lx34Wx2.5Hmm
Hole distance: 38x38mm, Weight: 180g
with thermal pad Honeywell PTM3180
RoHS & REACh compliant, Made in Taiwan
Productnr. 103517
1U passive BGA Chip Cooler E1NP-ASBI1-0000F
for BGA Chip Cooling, ChipSet Cooling
Socket uFCBGA479
1U Aluminum extruded heatsink
Dimensions: 49Lx50Wx36Hmm, Weight: 98g
Hole distance: 41x41mm
with thermal pad T725
RoHS & REACh compliant, Made in PRC
Productnr. 103278
1U passive BGA Chip Cooler for Atom E6xx T1SP-ASXX-0000D
for BGA Chip Cooling, ChipSet Cooling
Intel Atom E6xx
1U Aluminum skived Chip Sink
Dimensions: 59.5Lx60Wx13.5Hmm, Weight: 180g
Hole distance: 46.8x46.8mm
Fastener: Screw + Spring, Backplate included
RoHS & REACh compliant, Made in Taiwan
1U Aluminum heat sink for socket FCBGA1364
Dimensions 66Lx50Wx29.85Hmm, Weight 120g
Fastener: Screw + Spring set, include Backplate
RoHS & REACh compliant, Made in Taiwan