Shin Etsu G751 Syring 1.5 gr
Syringe package
Thermal Compound with a conductivity of 4.63 W / mK
1.5 grams equivalent to 0.75ml
Thermigrease TG20088 Syring with 5 gr
Thermal grease from about 80% ultra-fine silver and
a Boron nitride ceramic substrate.
By default, electrically nonconductive,
opt. Viscosity at 0 ° C to 150 ° C,
heat transfer coefficient 9.0W/mK
in syringe to 5 grams
Made in Germany
Thermigrease TG20088 Syring with 1 gr
Thermal grease from about 80% ultra-fine silver and
a Boron nitride ceramic substrate.
By default, electrically nonconductive,
opt. Viscosity at 0 ° C to 150 ° C,
heat transfer coefficient 9.0W/mK
in syringe 1 gram
Made in Germany
Thermigrease TG20088 Syring with 30 gr
Thermal grease from about 80% ultra-fine silver and
a Boron nitride ceramic substrate.
By default, electrically nonconductive,
opt. Viscosity at 0 ° C to 150 ° C,
heat transfer coefficient 9.0W/mK
In syringe to 35 grams
Made in Germany
Shin Etsu T11 Thermal Interface Pad
Shin Etsu T11 Thermal Interface Pad
Size: 20x20x0,3 mm
Honeywell PCM45 Thermal Interface Pad
High thermal conductivity (3 W / mK) and low
thermal impedance (< 0.25°C/W) Phase Change
Material (PCM) for high performance IC devices.
Size: 20 x 20 mm (+/- 0,2mm)
Thickness: 0.25 mm (+/- 0.065 mm)
Phase change at 45°C
32 pcs per sheet
Country of origin USA
Chomerics T725 Thermal Interface Pad
Thermal Interface for AMD Socket 7 processors
Dimension 25,4 x 25,4 mm with removal tab
Thickness 0,13 mm (0,005")
Thermal Impedance 0,03°C/W